Resin-made microchip "Joining Technology"
Our unique bonding technology has made it possible to achieve multilayer 3D flow paths!
The features of our injection molding materials include the ability to bond multiple structures to create excellent bonded structures and micro parts. The bonding surfaces are pressure-resistant, preventing liquid leakage and seepage, which allows for the creation of superior microstructures and micro parts. Channels can be produced with widths and depths ranging from approximately 1 to 200 μm, but they are particularly effective for three-dimensional channels around 1 to 50 μm. 【Features】 ■ Realization of multilayer three-dimensional channels ■ No adhesive required ■ High adhesion bonding ■ Can be manufactured from 1 μm wide channels ■ Patent Pat.No.4000401 <Bonded Structures> *For more details, please refer to the catalog or feel free to contact us.
- Company：リッチェル
- Price：Other
